TechWadi

Dr. Belgacem Haba

Recipient of TechWadi ‘s 2007 Technical Achievement Award 

 Fellow and CTO of Advanced Packaging and Interconnect, Tessera Inc.

Dr. Haba joined Tessera in 1996 and is now a Tessera Fellow  and  CTO of Advanced Packaging and Interconnect.  He is responsible for overseeing next-generation research and development activities for Tessera, Inc.

Dr. Haba is also a founder of SiliconPipe Inc., a high-speed interconnect start-up company based in Silicon Valley. Prior to that, he managed the advanced packaging research and development division at Rambus. From 1991 to 1996, he managed advanced research and development projects at the NEC Central Research Laboratories in Japan and, before that, worked for IBM at its T.J. Watson Research Center in New York.  During his tenure at NEC and IBM, Dr. Haba’s activities included the applications of lasers in the field of microelectronics.

Dr. Haba received his bachelor’s degree in solid state physics from the University of Bab-Ezouar, Algeria in 1980. He holds two master’s degrees in applied physics, materials science and engineering from Stanford University, Stanford, Calif., where he also earned a Ph.D. in materials science and engineering in 1988.  Dr. Haba holds 87 U.S. patents, and over 135 worldwide patents. He has authored numerous technical publications and has also participated in many conferences worldwide. Dr. Haba is member of the TechWadi and the AAA-NC associations.